Highly integrated, low-power T750 5G chipset delivers 5G
broadband experience
for 5G NR sub-6GHz frequencies
MediaTek today announced its T750 5G chipset to power next
generation 5G CPE wireless products, like fixed wireless access routers (FWA)
and mobile hotspots, to bring fast 5G connectivity into homes, businesses and
anyone on the go.
The highly integrated, 7nm
compact chip design comes with an integrated 5G radio and quad-core Arm CPU.
It’s full-featured with all the essential functions and peripherals for device
makers to build high performance consumer premise equipment products in the
smallest form factors possible. The T750 is sampling now with potential
customers.
5G routers with support for
sub-6GHz frequencies bring a more affordable broadband alternative to areas with
limited DSL, cable or fiber services. Having access to super-fast connectivity
will also be a game-changer for suburban, rural and less developed areas that
struggle with access to current wireless services and signals.
Analyst firm IDC expects
the global 5G and LTE router and gateway market to grow from approximately $979
million in 2019 to just under $3 billion in 2024. Counterpoint Research
also projects 5G fixed wireless access growing from 10.3M subscribers in
2020 to over 450M subscribers by 2030.
The MediaTek T750 chipset
supports 5G sub-6GHz frequencies and two component carrier
aggregation (2CC CA) for extended coverage, making it ideal for
indoor and outdoor fixed wireless access products, like home routers, as well
as mobile hotspots. In addition, the T750 design, which includes a 5G NR FR1
modem, quad-core Arm Cortex-A55 processors and the required peripherals all on
a single chip, offers performance and time-to-market advantages that speed up
ODM/OEM development times.
For consumers, the T750
offers a compact 5G device that they can self-install and avoid the hassles of
lengthy installation times for fixed line broadband. For operators, the T750
will provide 5G speeds right out the box to rival fixed line services without
incurring costs for laying down cables or fiber. The T750 chipset comes
pre-integrated with software drivers for MediaTek’s connectivity solutions such
as our 4x4 and 2x2 + 2x2 dual-band Wi-Fi 6 chipsets for distributing fast 5G
internet to consumers’ favorite client devices.
Additional T750 features include:
·
Support for standalone
and non-standalone (SA/NSA) sub-6GHz 5G networks
·
Two component
5G FR1 carrier aggregation in both FDD and TDD modes
·
Support for up
to 5CC LTE carrier aggregation
·
Embedded GPU
and display driver to support a HD display up to 720p
·
Four PCIe
interfaces for external Wi-Fi and Bluetooth
·
Two 2.5Gbps
SGMII interfaces to allow for a variety of LAN configurations
·
PCM interface
for external land-line phones
The T750 joins the MediaTek
family of 5G chips powering smartphones, smart homes and PCs. It leverages
MediaTek’s existing integrated circuits and intellectual property to help OEMs
accelerate time to market. MediaTek recently introduced its T700 5G data card
connectivity solution for PCs and other embedded applications. MediaTek boasts
a full tier of 5G Dimensity chips for smartphones. The Dimensity series are
powerful and power-efficient chipsets offering unrivaled connectivity,
multimedia, AI and imaging innovations for premium and mid-tier smartphones.
MediaTek is also the number one Wi-Fi supplier
across broadband, retail routers, consumer electronics devices and gaming, and
its Wi-Fi 6 chipsets are powering the latest networking equipment for faster
computing experiences.
HSINCHU,