MediaTek And realme Partners To Bring The First Smartphone Powered By Latest 5G-Integrated MediaTek Dimensity 810 6nm Processor - GADGET-INNOVATIONS

MediaTek And realme Partners To Bring The First Smartphone Powered By Latest 5G-Integrated MediaTek Dimensity 810 6nm Processor

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SoC offers customers brilliant imaging, smarter displays and boosted performance for incredible mobile experiences




MediaTek, the world’s 4th largest global fabless semiconductor company, is collaborating with realme, the world’s fastest growing smartphone brand to launch the first 5G smartphone powered by the latest MediaTek Dimensity 810 processor in India. The innovative new chip, launched earlier this month, redefines mainstream 5G smartphone experiences with flagship-class technology. MediaTek Dimensity 810 processor builds in great performance, premium displays, and supreme cameras for any situation, all in a leading 6nm chip design that raises the bar for 5G smartphone battery life.




realme’s new 5G smartphone will be the first ever smartphone to be powered by the MediaTek Dimensity 810 processor. realme is also India’s first smartphone brand to launch multiple MediaTek 5G processors, including MediaTek Dimensity 800U with realme X7 5G; MediaTek Dimensity 700 with realme 8 5G and MediaTek Dimensity 1200 with realme X7 Max 5G.




MediaTek Dimensity 810 provides Arm Cortex-A76 CPU speeds up to 2.4GHz, premium camera features including artistic AI-color in collaboration with ArcSoft, and advanced noise reduction techniques for superb low-light photography. Featuring TSMC’s leading 6nm production process, previously only available in flagship-class 5G phones, the MediaTek Dimensity 810 is one of the most power efficient chips available, giving brands new opportunities to create the slimmest and lightest 5G smartphones ever. 




Powered by MediaTek HyperEngine 2.0’s Intelligent Resource Management Engine offering enhanced power efficiency for even longer gameplay and supporting 2CC CA covering up to 120MHz of spectrum, including mixed duplex FDD+TDD connections, MediaTek Dimensity 810 SoC offers higher average speeds and a seamless handover between two 5G connection areas across a coverage layer, where users receive over 30% greater throughput layer coverage than without CA.




Key features of MediaTek Dimensity 810:

·  Faster Performance: Arm Cortex-A76 processors now support up to 2.4GHz in its octa-core CPU.


·  Faster Displays: Mainstream 5G smartphones can now benefit from crisp, high-res HD+ 120Hz displays for an ultra-smooth user experience.


·  Incredible Cameras: Supports advanced noise reduction techniques (MFNR & MCTF) for excellent low-light capture, and supports up to 64MP cameras.


·  High-end AI-Camera Features: Enables stunning camera experiences like AI-Bokeh and artistic AI-Color in collaboration with ArcSoft.


·  Smooth Gaming: Supports MediaTek’s HyperEngine 2.0 gaming technologies with an intelligent resource management engine and advanced networking engine.


·  Dual Sim 5G: Dimensity 810 provides dual 5G SIM to mainstream 5G smartphone users, allowing access to premium VoNR call services from either connection whenever they need it.



The Dimensity 810 5G SoC is the latest addition to MediaTek’s Dimensity series of 5G chips that offer smartphones an unrivaled combination of connectivity, multimedia, AI and imaging innovations to global markets with the Dimensity 700, 800, 900, 1000, 1100 and 1200 families. Across the globe, MediaTek technologies power smartphones, laptops, tablets, smart TVs, Blu-ray, voice assistant devices, smart speakers, Wi-Fi routers, smart home, IoT devices among others.



New Delhi, India – August 30, 2021